JPS58201202A - 半導体磁器用導電性ペースト - Google Patents
半導体磁器用導電性ペーストInfo
- Publication number
- JPS58201202A JPS58201202A JP8530682A JP8530682A JPS58201202A JP S58201202 A JPS58201202 A JP S58201202A JP 8530682 A JP8530682 A JP 8530682A JP 8530682 A JP8530682 A JP 8530682A JP S58201202 A JPS58201202 A JP S58201202A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor porcelain
- electrode
- conductive composition
- semiconductor
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 28
- 229910052573 porcelain Inorganic materials 0.000 title claims description 22
- 238000000034 method Methods 0.000 title claims description 12
- 239000000203 mixture Substances 0.000 title claims description 11
- 239000000843 powder Substances 0.000 claims description 6
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 229910000807 Ga alloy Inorganic materials 0.000 description 11
- 239000000919 ceramic Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000005036 potential barrier Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000000813 microbial effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8530682A JPS58201202A (ja) | 1982-05-20 | 1982-05-20 | 半導体磁器用導電性ペースト |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8530682A JPS58201202A (ja) | 1982-05-20 | 1982-05-20 | 半導体磁器用導電性ペースト |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3053287A Division JPH04211101A (ja) | 1991-02-25 | 1991-02-25 | 電圧非直線性抵抗素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58201202A true JPS58201202A (ja) | 1983-11-24 |
JPH0415563B2 JPH0415563B2 (en]) | 1992-03-18 |
Family
ID=13854908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8530682A Granted JPS58201202A (ja) | 1982-05-20 | 1982-05-20 | 半導体磁器用導電性ペースト |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58201202A (en]) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01276537A (ja) * | 1988-04-28 | 1989-11-07 | Oki Electric Ind Co Ltd | 厚膜導体及び薄膜導体の接続方法並びにプラズマ放電発光装置 |
EP0761617A1 (en) * | 1995-09-05 | 1997-03-12 | Cookson Matthey Ceramics Plc | Method and composition for forming electrically conducting silver tracks on glass |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5329383A (en) * | 1976-09-01 | 1978-03-18 | Sanshin Kasei Kk | Plywood of alminium and plastic plate |
JPS5585439A (en) * | 1978-09-18 | 1980-06-27 | Toshiba Corp | Glass adhering conductor paste |
-
1982
- 1982-05-20 JP JP8530682A patent/JPS58201202A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5329383A (en) * | 1976-09-01 | 1978-03-18 | Sanshin Kasei Kk | Plywood of alminium and plastic plate |
JPS5585439A (en) * | 1978-09-18 | 1980-06-27 | Toshiba Corp | Glass adhering conductor paste |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01276537A (ja) * | 1988-04-28 | 1989-11-07 | Oki Electric Ind Co Ltd | 厚膜導体及び薄膜導体の接続方法並びにプラズマ放電発光装置 |
EP0761617A1 (en) * | 1995-09-05 | 1997-03-12 | Cookson Matthey Ceramics Plc | Method and composition for forming electrically conducting silver tracks on glass |
Also Published As
Publication number | Publication date |
---|---|
JPH0415563B2 (en]) | 1992-03-18 |
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